New solder-down module features next-gen STM32 MPU to enable secure edge AI

Direct Insight now offers and supports development with QSMP-25 solder-down QFN-style SoMs, featuring second-generation STMicro STM32 MPUs.

“This new QSMP-25 solder-down module delivers an industrial-grade 64-bit solution for secure Industry 4.0 and advanced edge computing applications that require high-end multimedia capabilities,” commented David Pashley, co-founder and managing director at Direct Insight. “Incorporating high-performance connectivity, multimedia and display, with a Yocto-build mainline Linux BSP, this SoM simplifies design and production, with its QFN solder-down package optimising size and price, while simplifying PCB layout and EMI compliance.”

Manufactured by the company’s long-standing partner, Ka-Ro Electronics, the new QSMP-25 is a 29mm x 29mm QFN-style solder-down SoM featuring STMicroelectronics STM32MP255F MPUs. Dual ARM Cortex-A35 processors, clocked at 1.5GHz, are complemented by a 400MHz ARM Cortex-M33 MCU, a 1.24 TOPS NPU for AI/ML tasks, dual MIPI-CSI camera inputs, a powerful GPU, and an HD 60fps video pipeline.

The module adds 1GB LPDDR4 RAM, 4GB eMMC and power management, integrated on a tiny footprint QFN package for excellent EMC, thermal and cost optimisations. The module is square, with a height of 2.6mm, and requires a single 3.3V supply. A full industrial operating temperature range of -40C to +85C is supported.

A wide range of interfaces is supported, including dual USB 2.0 (with on-module PHYs), one USB 2.0 and one USB 3.0, PCIe, and dual Gb Ethernet. Other connectivity options include 3x UART, 3x I2C, 2x SPI, PWM, SAI, and 3x CAN. Advanced security features support IoT and industrial applications, ready for a CRA-compliant system implementation. The QSMP-25 comes with a dedicated Yocto Scarthgap build, providing a mainline Linux kernel, with full sources and toolchain supplied, with extensive documentation.