Effective surface-mount EMI/RFI solutions simplify design and manufacture
12-02-2015 |
Harwin
|
Design & Manufacture
Harwin has announced a portfolio of surface-mount products that can be used
separately or in combination to deliver effective EMI/RFI solutions. The
newcomers expand the company's popular EZ-BoardWare range and are designed
to take advantage of surface-mount technology, simplifying and speeding
manufacture, reducing costs and increasing quality.
EZ-BoardWare Shield Cans are simply pressed onto pre-positioned surface
mount EZ-Shield Clips forming a Faraday cage around sensitive ICs and
electronic circuitry. This saves expensive, labour-intensive secondary
assembly and facilitates rework. A range of can sizes and clips are
available. Attenuation performance up to 24dB can be achieved, depending on
frequency and configuration. The cans have a simple, five-sided box design,
which is mechanically robust and more cost-effective than fence and cover
types. Used with EZ-BoardWare Shield Can Clips, EZ-Shield Cans resist
vibration and remain securely retained on the PCB. As well as simplifying
maintenance and adjustment, auto placement of the EZ-BoardWare Clips
eliminates post-assembly soldering and de-soldering, significantly reducing
PCB damage caused by local overheating on the board.
In order to facilitate and expedite design, Harwin now offers these
EZ-BoardWare EMI/RFI protection screening products in kit form, enabling
designers to rapidly construct PCB cans at minimal cost for development
purposes. The low cost kits comprise two 80mm x 60mm x 0.3mm thick Nickel
Silver sheets that are pre-scribed on a 5mm grid to allowing easy cutting
and forming, enabling the user to produce a shield can of the required
dimensions. EZ-Shield Can Clips which hold the cans securely in place are
also included, says the company.
Product Manager, Paul Gillam, Harwin, said: "Now, a can may be created
easily and effectively in minutes, with no special tools or experience
required. We believe that the kits will save costs and time during
development, and help to enable that an optimised EMI/RFI solution is
found."
Completing Harwin's EZ-BoardWare EMI/RFI product range, EZ-Spring contacts -
also known as grounding / RFI contacts, spring or shield fingers - can be
assembled to PCBs and used as grounding or shielding contacts or even for
general electrical connection between PCBs or similar. When mounted in a
row, the contacts provide an excellent EMI/RFI shielding connection for
metal doors or other cabinet enclosures. The contact design ensures positive
contact with the mating surface, and is tolerant to both wiping and sliding
action. EZ-Spring Contacts are available in 15 different sizes, ranging from
1.7mm to 7.25mm free height (1.2mm to 6.35mm minimum working height) and as
multi-directional contacts, suitable for both vertical and horizontal
contact actions.
"We believe that with the range of EMC solutions that we have available, we
can help both the design engineer and the production engineer to realize a
better performing, more cost-effective answer to the EMI/RFI challenge,"
added Gillam.