Industrial


Module with double the heat dissipation for EV Buses, electric ships and stationary applications

Toshiba Electronics Europe has announced that Toshiba Corporation has launched a new SCiB module, a lithium-ion battery developed for use in EV buses, electric ships, and stationary applications. The new product features an aluminium basepl

Toshiba | 15-04-2025

New UPS for home and small business users

Eaton had launched its latest power protection solution: the 3P Ellipse UPS. Sleek, attractively designed, and silent in operation, this compact unit delivers excellent user experience in backup power for work and play in residential and sm

Eaton | 15-04-2025

Waterproof connector ensures reliable connections in harsh environments

Hirose has extended its popular LF Series of shielded high-speed Ethernet connectors to include a Cat.6a version supporting 10Gbps. The compact LF Cat6A Series provides a simple yet reliable bayonet lock mechanism for vibration resistance a

Hirose | 15-04-2025

Joint agreement developing a market-ready GaN power platform

IQE plc and X-FAB Silicon Foundries SE have announced a Joint Development Agreement (JDA) to create a European-based GaN Power device platform solution. With an initial two-year scope of work, the companies will collaborate to develop a

X-FAB | 15-04-2025

ISFET-based pH sensor-control successfully miniaturised and optimised for easy use

The Fraunhofer Institute for Photonic Microsystems IPMS has achieved another milestone in chemical liquid analysis. The electronics needed to control the ISFET have been successfully miniaturised. At the same time, manufacturing costs and p

Fraunhofer | 15-04-2025

Low ON-resistance and high-power MOSFETs for high-performance enterprise and AI servers

ROHM has developed N-channel power MOSFETs with industry-leading low ON resistance and wide SOA capability. They are designed for power supplies inside high-performance enterprise and AI servers.  The advancement of high-level data

ROHM Semiconductor | 15-04-2025

Ceramic 3D printing is now available in Europe

KYOCERA Fineceramics Europe GmbH now offers the production technology 'Ceramic Additive Manufacturing' for customers in Europe. Employing this method, products with complex geometries and almost any type of customised shape can be manufactu

Kyocera AVX | 15-04-2025

MCUs for advanced automation and smart applications

Mouser Electronics, Inc. now supplies the new RA8E1 and RA8E2 MCUs from Renesas Electronics. The MCUs deliver multiple integrated low-power modes and features to enhance efficiency and streamline costs for general-purpose and advanced voice

Mouser Electronics | 14-04-2025

Optimising power solutions with high-efficiency DC-DC controller

The Analog Devices LTC3780EG#TRPBF is a high-efficiency synchronous DC-DC controller, delivering excellent power management capabilities for various applications. This versatile component stands out for its ability to streamline power conve

WIN SOURCE | 14-04-2025

New 64-bit Arm computers deliver trusted IIoT solutions

Moxa Europe GmbH has launched its next-generation 64-bit Arm-based computers UC-3400A and UC-4400A Series, featuring industry-leading dual-wireless, 5G/LTE and Wi-Fi 6 connectivity. Built around an Arm Cortex-A53 quad-core processor and off

Moxa | 14-04-2025

Current sensors and fan driver ICs deliver improved performance and energy efficiency

Allegro MicroSystems, Inc. has announced three new solutions to enhance motor control and thermal management performance in e-mobility and industrial automation applications. These new solutions, the ACS37035 and ACS37630 current sensors, a

Allegro | 14-04-2025

3D linear Hall effect sensor simplifies automotive rotary motion and proximity detection

Diodes Incorporated has introduced its first automotive-compliant 3D linear Hall effect sensor. The AH4930Q detects the magnetic field in the X, Y, and Z directions, permitting reliable and high-precision contactless rotary motion and proxi

Diodes Inc | 14-04-2025

PCIe 5.0-compatible broadband optical SSD for next-generation green data centres

KIOXIA Corporation, AIO Core Co., Ltd. and Kyocera Corporation have announced the development of a prototype PCIe 5.0-compatible broadband SSD with an optical interface (broadband optical SSD). The three companies will develop technologies

Kioxia | 14-04-2025

New high-speed optimised flip-chip package technology for automotive ESD protection

New flip-chip land grid array (FC-LGA) packages deliver superior RF performance and meet automotive quality with the industry's first side-wettable flank versions Nexperia has announced a new portfolio of high signal integrity, bidirecti

Nexperia | 14-04-2025


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