Amphenol RF has introduced SMA straight plug to straight plug cable assemblies into its extensive interconnect portfolio. These robust jumpers are designed on industry-standard TFC 302LL cable, which offers a low-loss solution for new desig

Amphenol | 08-07-2025

Xsens has launched the Xsens Avior, a lightweight, OEM form factor IMU with a compact 36.8mm x 40mm footprint, which provides enhanced performance in a wide variety of industrial and commercial applications. The device is ideal for high-

Xsens | 07-07-2025

Murata Manufacturing Co., Ltd. announced that the new GCM21BE71H106KE02 MLCC has entered mass production. The device is the world's first 0805-inch size (2mm x 1.25mm) MLCC to provide a capacitance of 10µF with a 50VDC rating and is specifi

Murata | 07-07-2025

Renesas Electronics Corporation has introduced three new high-voltage 650V GaN FETs for AI data centres and server power supply systems, including the new 800V HVDC architecture, e-mobility charging, UPS battery backup devices, battery ener

Renesas | 04-07-2025

FORTEC United Kingdom has introduced the COM-MTHC6, a high-performance COM Express Type 6 Compact module developed to meet the rigorous demands of embedded computing in transportation and defence environments. Combining cutting-edge process

FORTEC United Kingdom | 04-07-2025

ESPEC has released a new thermal cycle chamber capable of delivering a controlled specimen temperature ramp rate of 20K/min, developed to satisfy the growing demands of international standards for semiconductor and electronics reliability t

Unitemp | 04-07-2025

Virtium Embedded Artists has launched the iMX8M Mini DX-M1, a SoM which integrates a quad-core application processor and a 25 TOPS AI hardware accelerator chip with associated memory on a board with a compact 82mm x 50mm footprint. By in

Virtium Embedded Artists | 03-07-2025

TDK Corporation now offers global availability of the InvenSense SmartAutomotive IAM-20680HV, a high-value six-axis IMU designed for a variety of in-cabin applications that also need the component to withstand harsh conditions up to +125C,

TDK | 02-07-2025

Toshiba Electronics Europe GmbH has begun shipping samples of the TB9M001FTG, the second product in the innovative Smart Motor Control Driver (SmartMCD) series. This highly integrated device is specifically developed to deliver efficient an

Toshiba | 02-07-2025

Danisense introduces the DSSIU-1-V, a new low-noise power supply and interface unit designed to support a wide range of its flux gate current transducers (DCCTs). Featuring an industry-standard D-sub-9 connector, the unit provides reliable

Danisense | 02-07-2025

Amphenol RF has introduced additional high-performance FAKRA to SMA adapters into its extensive catalogue of RF interconnect products. With cross-system compatibility, the FAKRA to SMA adapter is designed to connect FAKRA-dependent automoti

Amphenol | 02-07-2025

FORTEC UK’s COM-MTHC6 module delivers advanced embedded computing capabilities in a compact, rugged format. Designed to meet the needs of high-performance, space-constrained applications, the module is built on the COM Express Type 6 Compac

FORTEC United Kingdom | 01-07-2025

Tyre pressure sensors play a vital role in ensuring safety and efficiency in road traffic, whether for motorcycles, trucks, cars, or buses. They help to extend tire life, reduce fuel consumption, and increase vehicle safety. Tyre pressure m

Bosch | 01-07-2025

Molex has introduced TrackLabel BLE Printable Asset Labels, which deliver real-time location tracking data to enhance operational efficiency, security, and visibility across global supply chains. This innovative smart label platform integra

Molex | 01-07-2025