Advantech has announced the release of the SQRAM CXL 2.0 Type 3 Memory Module. Compute Express Link (CXL) 2.0 is the next evolution in memory technology, delivering memory expansion with a high-speed, low-latency interconnect designed to sa

Advantech | 28-01-2025

SiTime Corporation has announced the differential ended SiT5977 Super-TCXO, the newest SiTime Elite RF family member. This is the only single-chip timing solution that provides the most resilient performance for AI compute-nodes with high b

SiTime Corporation | 21-01-2025

L-com, an Infinite Electronics brand, has added a new line of 42U server rack cabinets, available in black or white. The EIA 19"-wide cabinets come in three depths, permitting them to hold high-density networking equipment for large-office

L-com | 14-01-2025

Mouser now stocks the Molex HyperQube 6.00mm interconnect system. The high-voltage, high-current connector system delivers reliable mating performance in space-constrained devices. Designed to satisfy rigorous industry standards, the interc

Mouser Electronics | 09-12-2024

Alphawave Semi has joined the newly formed Ultra Accelerator Link Consortium (UALink). With the emergence of accelerated compute infrastructure to facilitate AI workloads spanning compute, training and inference, new purpose-built scale-

Alphawave Semi | 06-12-2024

Designed for the edge computing era, Innodisk's E1.S SSD aims to increase performance in AI and edge applications with high reliability and efficiency. The E1.S edge server SSD provides outstanding performance, reliability, and thermal m

Innodisk | 26-11-2024

MSI has unveiled its latest AMD EPYC 9005 Series CPU-based server boards and platforms. Built on the OCP Modular Hardware System (DC-MHS) architecture, these new platforms deliver high-density, AI-ready solutions, including multi-node, ente

MSI | 22-11-2024

Renesas Electronics Corporation has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 MRDIMMs. The new DDR5 MRDIMMs must keep pace with the ever-increasing memory bandwidth demands

Renesas | 22-11-2024

The RACPRO1 family from RECOM is now available from Rutronik. The range comprises industrial DIN rail power supplies, eFuses, and redundancy diodes for usage in extremely demanding applications, such as harsh industrial environments, and ou

Rutronik | 20-11-2024

Micron Technology, Inc. has begun qualification of the 6550 ION NVMe SSD with customers. The Micron 6550 ION is the world’s fastest 60TB data centre SSD and the industry’s first E3S and PCIe Gen5 60TB SSD.1 It follows the success of the awa

Micron | 18-11-2024

Mouser now stocks the QSFP-DD 112G connectors and cages from TE Connectivity. TE's stacked quad small form factor pluggable double density (QSFP-DD) 112G connectors and cages provide improved interconnect solutions for data infrastructur

Mouser Electronics | 13-11-2024

Navitas Semiconductor will be previewing several breakthroughs at electronica 2024. Aligned with the mission to 'Electrify our World', the 'Planet Navitas' booth invites visitors to discover how next-gen GaN and SiC technology allows the la

Navitas Semiconductor | 30-10-2024

Toshiba Electronics Europe GmbH has released two new products to its eFuse IC offering. The TCKE903NL and TCKE905ANA products are reusable, thereby decreasing maintenance costs and recovery time for equipment repairs and supporting various

Toshiba Electronics | 29-10-2024

Power supply designers for AI servers face considerable thermal challenges. Because of the size constraints for AI server rooms, many methods of heat reduction are impractical, need complex implementation, or are costly. Thermal jumpers pro

Stackpole | 28-10-2024