STMicroelectronics has introduced the Teseo VI family of GNSS receivers aimed at high-volume precise positioning use cases. For the automotive industry, Teseo VI chips and modules will be core building blocks of ADAS, smart in-vehicle syste

STMicroelectronics | 05-03-2025

Anritsu Corporation and MediaTek have verified Smart AI Antenna Technology featured in MediaTek's M90 5G Modem using Anritsu's Radio Communication Analyser MT8821C. Smart Antenna, developed by MediaTek, is an advanced antenna technology

Anritsu | 04-03-2025

Ulefone has launched the performance powerhouse Armor 28 Ultra Series. Dimensity 9300 plus global debut, 16GB plus 1TB massive storage. Its Thermal Version features next-gen AI-powered thermal imaging. The company launched the Armor 28 Ultr

Ulefone | 04-03-2025

ROHM has developed 650V GaN HEMTs in the TOLL. package: the GNP2070TD-Z. Featuring a compact design with exceptional heat dissipation, high current capacity, and superior switching performance, the TOLL package is increasingly being adopted

ROHM Semiconductor | 03-03-2025

Murata and Rohde & Schwarz have developed the world's first Voice over Narrowband Non-Terrestrial Network (NB-NTN) testbed. To be presented at Mobile World Congress 2025, this innovative demonstration marks a notable leap in 3GPP-based

Murata | 28-02-2025

Amphenol RF expands its BNC connector portfolio with options suited for use with versatile and highly flexible micro-miniature 0.81 mm, 1.32 mm and 1.37 mm cables. Amphenol RF has expanded its BNC product portfolio with extra options fea

Amphenol | 24-02-2025

EMITE and Anritsu Corporation have announced the enhanced functionality of the OTA measurement solution, permitting measuring to comply with the latest Wireless LAN standard IEEE 802.11be for 2x2 MIMO. The IEEE 802.11be standard is set t

Anritsu | 24-02-2025

Kyocera Corporation has begun the full-scale development of an AI-powered 5G virtualised base station, with plans to commercialise the technology. As digital transformation (DX) accelerates globally, 5G mobile networks have become a crit

Kyocera AVX | 21-02-2025

Amphenol RF has introduced additional pre-configured 2.92mm cable assembly configurations, which feature a 2.92mm connector and the option of an SMP or SMPM connector attached to the opposing end. They are available in pre-configured length

Amphenol | 20-02-2025

VertiGIS has announced the VertiGIS ConnectMaster for ArcGIS, a cutting-edge platform designed to transform how telecommunications network operators and utilities manage their network inventory and operations. ConnectMaster has been the

VertiGIS | 20-02-2025

SV Microwave has launched a new line of high-performance adapters that operate at frequencies of up to 65GHz and can produce outstanding signal performance. These adapters provide a high-density push-on interface on one end and a reliable,

SV Microwave | 12-02-2025

u-blox has expanded its portfolio with six new variants of the NORA-B2 BLE modules. Now integrating the complete range of Nordic Semiconductor's next-level nRF54L Series of ultra-low power wireless SoCs, NORA-B2 provides a versatile solutio

U-Blox | 12-02-2025

SV Microwave now offers its 75Ω VITA 67.3 SMPM contacts from its expanded VITA portfolio. This product line reflects that investment, placing the company at the edge of the latest VITA applications like higher-speed video, which will be inc

SV Microwave | 07-02-2025

Fairview Microwave, an Infinite Electronics brand, has announced the launch of its new 1mm test cable assemblies, designed for high-performance test setups needing superior durability and signal integrity. These assemblies are made with

Fairview Microwave | 30-01-2025