27-10-2015 | Lattice | Design Applications
Lattice Semiconductor has announced that its MachXO3 FPGA and USB 3.0 sensor bridge reference design are integrated in a new USB 3.0 camera module from Leopard Imaging, a leader in high-definition embedded cameras.
The MachXO3 FPGA and the USB 3.0 sensor bridge reference design work together to convert the subLVDS video signal from the image sensor used in the module to a parallel format that can interface with the camera’s USB 3.0 controller. The ability to convert the video signal to a format compatible with the USB controller allows the embedded camera module to be used in a wide variety of industrial systems.
“With the multitude of video standards being used in embedded applications, it’s vital that we are able to convert those signals into whatever formats a particular industrial system requires,” said Bill Pu, president, Leopard Imaging. “Lattice Semiconductor’s MachXO3 FPGA provided the programmability and bridging functionality in the small form factor our USB 3.0 camera module requires, and their sensor bridge reference design accelerated our ability to incorporate the Lattice technology into our final product.”
“Camera image sensor interfacing is an increasingly popular feature in embedded applications,” added Deepak Boppana, director of product marketing, Lattice Semiconductor. “Our MachXO3 FPGAs can deliver I/O speeds of up to 900Mbps, so our customers can convert even high-quality video images into any desired format, without compromising overall video system performance.”
Reference designs are available for subLVDS, MIPI CSI-2, HiSPi and USB3 FX3 controller interfacing and bridging and can be customized to match the applications, says the company.
