LEDs small in size with narrow footprint and low profile

Broadcom HSMF-C11x Tricolor ChipLEDs, available from Mouser, are small in size with a narrow footprint and low profile for back lighting, status indication and front panel illumination. They are offered in tape and reel to facilitate pick and place operation. The package is compatible with IR soldering and binned by both colour and intensity. Their HSMF-C116 ultra small surface mount Tricolor ChipLEDs are designed for close pitch assembly and portable and wearable applications. The package uses high intensity red AlInGaP and high intensity InGaN green and blue die. The PCB substrate has a black surface to improve contrast. The HSMF-C113/C115 right angle Tricolor surface mount ChipLEDs are housed in an ultra small package and are the first of its kind to achieve such small packaging for three dies. They yield a variety of colours with the ability of mixing the three primary colours to suit any application and product theme. HSMF-C114 surface mount Tricolor ChipLEDs are designed in an ultra small package and are the thinnest package for tricolour packaging. Yield a wide variety of colours with mixing of the three primary colours to suit any application and product theme. The HSMF-C118 TriColor ChipLEDs are designed in an ultra small package and are the first of its kind to achieve such small packaging for three dies. They yield a variety of colours with the ability of mixing the three primary colours to suit any application and product theme. These products are suitable for backlighting, status indicator, front panel indicator, office automation, home appliances and industrial equipment.