Heatsink cooling aggregates offer combined functionality of heatsink and fan

Available from stock at Farnell element14, the compact-sized heatsink cooling aggregates from Fischer Elektronic, offers very low thermal resistance for an accelerated and improved heat dissipation and better board performance. Heatsink cooling aggregates from the company have the combined functionality of a heatsink and a fan, with very low thermal resistance down to 1,1K/W (Rth), offering very low thermal resistance for an accelerated and improved heat dissipation and better board performance. The devices are available with grooves for lock-in retaining springs THFU, plus screw-in solder pin M3, also a range of lengths, surfaces, fan types and voltages as per customer specifications. The compact size of the device makes them suitable for a wide range of applications and project types, particularly those where space is a premium.