15-07-2016 | Alliance Memory | Semiconductors
Alliance Memory has introduced a new monolithic high-speed, low-voltage CMOS double data rate 3 synchronous DRAM (DDR3L SDRAM) with an 8Gb density in the 78-ball, 9mm x 13.2mm, lead (Pb)-free FBGA package. Delivering increased power efficiency for high-end computer and storage systems, the 1G x 8 AS4C1G8MD3L''s double data rate architecture delivers extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800MHz. The AS4C1G8MD3L's transfer rates are twice as high as DDR and DDR2 SDRAMs, providing higher bandwidth for newer-generation microprocessors in industrial, medical, networking, telecom, and aerospace applications. The 8GB DDR3L SDRAM operates from a single +1.35V power supply and is backwards-compatible with +1.5V power supplies to enable large memory subsystems. The device is a logical choice for users that require increased memory yet face board space constraints. The AS4C1G8MD3L is available with an extended commercial temperature range of 0C to +95C (AS4C1G8MD3L-12BCN). Internally configured as eight banks of 1G x 8 bits, the DDR3L SDRAM features a fast 64-ms, 8192-cycle refresh from 0C to +85C and 32ms from +85C to +95C. The device offers fully synchronous operation and provides programmable read or write burst lengths of 4 or 8. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh, and a programmable mode register allows the system to choose the most suitable modes to maximize performance. In addition to the 1G x 8 AS4C1G8MD3L, Alliance Memory also offers the 512M x 16 AS4C512M16D3L in the 96-ball FBGA package, which is available in an extended commercial temperature range (AS4C512M16D3L-12BCN) and an industrial temperature range from -40C to +95C (AS4C512M16D3L-12BIN). Also, with minimal die shrinks, the single-die AS4C1G8MD3L provides a reliable drop-in, pin-for-pin-compatible replacement for a number of similar solutions - eliminating the need for costly redesigns and part requalification, says the company.