Low cure conductive epoxy adhesive bonds to many substrates
26-07-2016 |
RS Components
|
Subs & Systems
The MG Chemicals 8330S, available from RS Components, is a slow cure conductive epoxy adhesive that bonds to many substrates that are used in electronics assemblies. The adhesive resists thermal and mechanical shocks and has been designed for production environments when high cure temperatures can damage your heat-sensitive components.
Typical applications are for repair and assembly in opto-electronics and microelectronics, and for use in the aerospace, marine communication and industrial control equipment industries.
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