Protect wire bonds and reduce stresses associated with thermal cycling

Engineered Material Systems (EMS) has introduced new 640-35 (dam) and 640-46 (fill) dam, and fill UV cured chip encapsulants for chip-on-board smart card applications. Engineered to withstand circuit board reliability test criteria, the encapsulants are designed to protect wire bonds and reduce the stresses associated with thermal cycling. The dam and fill UV cured chip encapsulants cure rapidly when exposed to intense UV light centred at 365nm. They have been developed for encapsulating small chips in smart card applications where fast processing is required, says the company.