I/O and backplane assemblies dramatically reduce signal to noise ratios and simplify installation

Molex is rolling out its new BiPass I/O and backplane cable assemblies, combining QSFP+, Impel or near-ASIC connectors with thin twinax cables. The BiPass I/O and Backplane Assemblies provide a low-insertion-loss alternative to PCB traces capable of meeting 112Gbps PAM-4 (pulse-amplitude modulation) protocol. “BiPass Assemblies offer our customers a complete solution to enable 56Gbps and 112Gbps PAM-4 implementation by dramatically reducing signal to noise ratios from the ASIC to I/O,” said Brent Hatfield, new product development manager, Molex. “The integrated, one-piece design using board-mount connectors also ensures easy installation for contract manufacturers.” The assemblies are ideal for applications in several markets, including data communications as well as telecom and networking. Assemblies are thoroughly tested, eliminating the need for customers to conduct their own tests. They can be easily customised to individual front panel configurations, according to the needs of specific applications.