New family of wideband plastic packaged and bare die MMIC GaAs devices offering high performance

Microsemi Corporation has announced a new family of wideband plastic packaged and chip monolithic microwave integrated circuit (MMIC) devices. The new products adds to a growing portfolio of high performance wideband MMICs and include four plastic packaged LNAs, MMA040PP5, MMA041PP5, MMA043PP4 and MMA044PP3; a wideband power amplifier (PA) chip, MMA053AA; and two plastic packaged switches, MMS006PP3 and MMS008PP3. The new packaged amplifiers include two new distributed LNAs (MMA040PP5 and MMA041PP5) which outperform competitive parts over a wider frequency from DC to 27GHz with higher gain of 17dB and OIP3 of 35dBm. They are packaged in a small 5mm plastic QFN package ideal for size constrained applications. Two additional wideband LNAs (MMA043PP4 and MMA044PP3) provide exceptionally low NF from 0.5GHz to 18GHz with typical NF below 2dB and no more than 2.5dB at the band edge. “Our new product introductions represent Microsemi's significant investment in enhancing our MMIC product portfolio as we continue to address our customers' overall requirements,” said Kevin Harrington, director of strategic marketing for Microsemi’s RF/Microwave Discrete Products business unit. “We are committed to being a long-term trusted supplier of superior performance MMIC products for our customers as we continue to invest and expand leading-edge MMIC devices.”