Thermal interface material offers high performance, low cost and custom sizes
06-07-2017 |
Mouser Electronics
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Subs & Systems
Wakefield-Vette ulTIMiFlux Thermal Material, is now available from Mouser, offering high performance, low cost, configurability and custom sizes for thermal system needs. Thermal interface materials (TIM) are a secondary material installed between the heat sink and the device that are designed to improve the thermal transfer to the heat sink.
The company’s line of dielectric phase change thermal materials are intended to fill voids between a device and the heat sink. The material utilizes a polymide film which acts as a thermally conductive carrier to deliver uniform thickness coating of phase-change thermal compound on both sides. These materials are an effective ‘drop in place’ solution making an excellent replacement for thermal greases.