New rectifiers save significant space while increasing power density and efficiency

21-07-2017 | Vishay | Passives

Vishay Intertechnology has expanded its offering of surface-mount TMBS Trench MOS Barrier Schottky rectifiers with 10 new 1A and 2A devices in the eSMP series MicroSMP (DO-219AD) package. Providing space-saving alternatives to Schottky rectifiers in the SOD123W, the devices feature reverse voltages from 45V to 150V and include the industry's first 2A TMBS rectifiers in the MicroSMP to deliver forward voltage as low as 0.4V. Currently, Schottky rectifiers with current ratings to 2A are typically available in the SOD123W and SMA packages. The devices released today increase power density by offering this high forward current in the smaller MicroSMP. Measuring 2.5mm x 1.3mm with a low 0.65mm profile, the package is 35% thinner than the SOD123W while occupying 45% less board space. For excellent thermal performance, the MicroSMP features an asymmetric leadframe design. The new rectifiers feature a maximum operating junction temperature up to +175C and an MSL moisture sensitivity level of 1, per J-STD-020, LF maximum peak of +260C. Ideal for automated placement, the devices are RoHS-compliant and halogen-free.
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