Modules enable manufacturers to conserve PCB space at half the cost

08-12-2017 | Vincotech | Subs & Systems

Vincotech released its new six-pack modules. The latest additions to the company's flow90 line of innovative housings, the flow90PACK 0 and flow90PACK 1 are the ideal match for bookshelf inverters and rack-mounted power applications. These products make the most of PCB space to reduce the applicationā€˜s footprint. The company's devices are rated for up to 75A and up to 1200V. Packaged in flow90 housings, they remove the need for L-shaped heat sinks, decreasing costs by half. The pins on the modules are arrayed at a 90-degree angle, so there is no need for a flexible PCB. What's more, a layout with this angle between the PCB and heat sink decreases the footprint by as much as 40%.
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