Modules enable manufacturers to conserve PCB space at half the cost
08-12-2017 |
Vincotech
|
Subs & Systems
Vincotech released its new six-pack modules. The latest additions to the company's flow90 line of innovative housings, the flow90PACK 0 and flow90PACK 1 are the ideal match for bookshelf inverters and rack-mounted power applications. These products make the most of PCB space to reduce the applicationās footprint.
The company's devices are rated for up to 75A and up to 1200V. Packaged in flow90 housings, they remove the need for L-shaped heat sinks, decreasing costs by half. The pins on the modules are arrayed at a 90-degree angle, so there is no need for a flexible PCB. What's more, a layout with this angle between the PCB and heat sink decreases the footprint by as much as 40%.