Nanosilica filled epoxy meets NASA low outgassing specifications

Master Bond EP30NS is a two-component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear particularly in thin sections and can be applied as a sealant, adhesive, coating and encapsulation compound. The system offers dimensional stability, linear shrinkage of less than 0.01%, superior physical strength characteristics and cures rigid. Most importantly, the system has been independently tested per ASTM D4060-14 for abrasion resistance for 1,000 cycles and exhibited a loss of weight of only 18.3mg. “Master Bond EP30NS has a Shore D hardness of 80-90”, says Rohit Ramnath, senior product engineer. “It possesses a coefficient of thermal expansion of 30-35 x 10-6 in/in/C and is well suited for small potting applications. Its long-term electrical insulation characteristics are quite impressive. Also noteworthy is that EP30NS has a tensile strength of 9,000-11,000 psi and a refractive index of around 1.56 at 589 nm.”