Complete computer in a 27mm package includes all components in a single BGA device

Octavo Systems offers a completely integrated 1GHz Arm Cortex-A8 computing platform, the OSD335x C-SiP. The C-SiP (Complete System-In-Package) integrates the needed components for a computing system into a single IC package that is around the size of a standard Lego block. The latest addition to the family, the OSD335x C-SiP is a total system comprising the 1GHz Arm Cortex-A8 Sitara AM335x processor from Texas Instruments, up to 1GB of DDR3 RAM, 4KB EEPROM, two power supplies, up to 16GB of eMMC Non-Volatile Flash Memory, a MEMS Oscillator, and over 100 passive components into its single 27mm x 27mm 400 Ball BGA Package. “The addition of the eMMC and the Oscillator to the processor, ram, and power supplies, makes the OSD335x C-SiP a complete system. It has everything you need for a powerful Linux computer integrated into a small, easy to use package. All you need to do is add power and a couple of resistors. That is why we call it a Complete System-In-Package.” says Gene Frantz, CTO of Octavo Systems. Through the integration of OSD335x C-SiP, many of the repetitive and tedious tasks associated with designing a computing system are removed. Things like laying out DDR3 memory interfaces and power sequencing are no longer required. Also, any concerns about Electromagnetic Interference (EMI) caused by the layout of the Oscillator are alleviated. “We estimate that using the OSD335x C-SiP will enable designers to get a system working in half the time required to design a discrete solution,” comments Erik Welsh, application engineering manager of Octavo Systems. “This is time they can spend refining or adding new features to further differentiate their product, or they can simply get to market quicker.”