One component epoxy satisfies NASA low outgassing specifications

Master Bond EP17HTND-CCM is a new single component epoxy which is not premixed and frozen. The product is more convenient to handle, apply and store than typical two-component glob top systems. The black, heat curable compound has a flowable paste consistency perfect for glob top, chip coating and bonding applications. The product satisfies NASA low outgassing specifications and is serviceable from -80F to +600F (-62C to +316C). This adhesive forms high strength bonds to a broad range of similar/dissimilar substrates such as ceramics, metals, composites, plastics and various circuit board materials. The epoxy is thermally conductive and electrically non-conductive even upon exposure to hostile environmental conditions. The product provides a high volume resistivity of more than 1015Ohm-cm at 75F and over 1012Ohm-cm at 400F. Its thermal conductivity is 9-10BTU•in/ft2•hr•F (1.4423W/(m•K)) at 75F. The epoxy can resist many chemicals including acids, salts, bases, fuels, oils and many solvents. Formulated for various electronic applications, the product cures readily in 1-2 hours at 350F (175C) with a relatively low exotherm upon curing. It can be dispensed from a syringe, either manually or with an automatic dispenser.