30-10-2019 | Electronic Products | Subs & Systems
Electronic Products now has the advanced abilities to create Hi-rel Transistor Outline, or 'TO', packages and headers.
The company’s focus has been on improving upon standardised TO packages and headers made of metals that assist in satisfying the most uncompromising hermetic standards and screening demands of today’s Hi-rel semiconductor devices and components.
The basic TO or 'metal can' package consists of a metal base with leads leaving through a glass seal. The glass sealing process is amongst the various areas in which the company has innovated, particularly in their compression seal and matched seal technology. These matched seals typically use CTE matched ASTM-F15 Alloy, and CTE matched glass compositions. Their highest performing compression seals employ plain carbon steel 1010 and ASTM-F30 with higher CTE to compress the glass upon cooling throughout the fusing process of the TO package or header. After device assembly in the package, the client uses a metal lid which is expertly resistance welded with precision to the metal base to create a superior hermetic seal.
