25-11-2019 | SET | Subs & Systems
SET (Smart Equipment Technology) has released the NEO HB, an automatic flip-chip bonder designed for ±1µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM). The device is ideal for direct hybrid bonding processes.
The first of a new line of the company's flip-chip bonders devoted solely to production, the tool consolidates high precision, flexibility, short cycle time, and creative design. It was produced in collaboration with CEA-Leti as part of IRT Nanoelec’s 3D integration program.
“SET joined IRT Nanoelec in 2016 with the goal to develop a brand-new tool for direct-bonding applications that delivered high accuracy and high throughput, and a high level of cleanliness,” said Pascal Metzger, CEO of SET. “That ambition required a strong collaboration among experts from different disciplines. Today, SET’s team is proud to commercially launch NEO HB, which meets the initial technical targets and will address development and production needs for tomorrow’s chips.”
“This intensive, exciting, and fruitful collaboration allowed us to design a bonding solution adapted to fine-pitch assembly needs,” added Nicolas Raynaud, project manager at SET.
Séverine Chéramy, director of IRT Nanoelec’s 3D integration program, said the objective when SET joined the consortium was to provide IC designers with 3D die-to-wafer stacking at an aggressive pitch – less than 10µm – at high speed, at room temperature, and without pressure or underfill.
“Achieving this goal with NEO HB is a major success of the 3D program and highlights the IP and expertise offered by IRT Nanoelec,” she said. “By overcoming daunting technical challenges and building this bonder, the team has opened the huge potential of die-to-wafer direct hybrid bonding technologies for a wide range of applications.”
“For the past eight years, I was strongly engaged in the promotion of 3D technologies developed within our IRT, and I believe this achievement outlines the added value of our institute for the local ecosystem in advanced semiconductor technologies,” Hughes Metras, the recently appointed director of Nanoelec said.
