17-12-2019 | Inseto (UK) Ltd | Subs & Systems
Inseto now supplies DELO’s new MONOPOX TC2270, a thermally conductive, electrically insulating adhesive, which is excellent for bonding silicon die and other applications where rapid heat transfer is vital.
With a specific thermal conductivity of 1.7W/mK, the solution assures efficient heat transfer between die and packaging. It is also more affordable than silver epoxy.
Provided in 10ml syringes, the adhesive possesses many other benefits too. For instance, the minimum curing temperature is 60C in about 90 minutes, which means it can be employed with temperature-sensitive materials with little risk of adding stress or causing warpage. Moreover, it is a one-part adhesive, so no mixing is needed and storage is at -18C, a temperature supported by standard commercially available freezers; whereas most die-attach adhesives require to be stored in industrial freezers at much lower temperatures, such as -40C.
Once cured, the adhesive gives a die shear strength of 60N/mm2 and offers an end-application use range of -40C to +150C, which is more than sufficient for most silicon-based semiconductors.
Eamonn Redmond, sales manager of Inseto, comments: “The adhesive’s chemistry includes aluminium nitride, which ensures heat is quickly transferred away from the die, thus increasing the potential lifetime of the chip. Also, the fact that it is readily available in 10ml syringes means that users reduce the risk of having to dispose of out-of-date adhesive.”
Redmond concludes: “The TC2270 is an extremely useful adhesive in the world of microelectronics and in any application where heat must be transferred without establishing an electrical connection.”
