20-04-2020 | Dialog Semiconductor | Subs & Systems
Dialog Semiconductor has launched the DA14531 SmartBond TINY module, enabling customers to construct the next generation of connected devices.
The module was particularly optimised to significantly decrease the cost of adding Bluetooth low energy functionality to an IoT system. The device's easy-to-use design and software enable developers to quickly and intuitively produce highly functional connected devices, aimed at the next generation of the connected consumer, connected medical, smart home and smart appliance applications. The module includes two unique software features created to remove the complexity often associated with traditional Bluetooth low energy development and enables customers to create robust IoT products regardless of their software coding abilities.
“The launch of the SmartBond TINY DA14531 SoC in 2019 set a new industry benchmark for BLE SoC pricing. The DA14531 module further leverages the capabilities of the SoC, including an integrated antenna and all required components, to add BLE functionality to an IoT system in high volumes. That price point for BLE functionality, performance and quality is unmatched by competitors,” said Sean McGrath, Senior VP, Connectivity and Audio BG, Dialog Semiconductor. “Not only is this module breaking barriers in terms of cost and power, it is extremely easy for both beginners and experts to use, ensuring that all customers can benefit from its high level of integration and programmable ease of use.”
The hand, solderable stamp type module, provides nine GPIOs and measures 12.5mm x 14.5mm in size. All external components, including passives, XTAL, antenna and FLASH memory, are integrated into the module so that customers do not need to source individual components separately.
