20-08-2020 | DELO | Subs & Systems
DELO has released a new die attach adhesive to replace the previous MONOPOX MK096. The adhesive features high strength even after ageing and can be dispensed yet more precisely than its predecessor. This has been proved in tests together with the machine integrator ASM Assembly Systems. The fluorescent adhesive is ideal for long-term usage in a broad range of applications.
Like its predecessor, it is a heat-curing one-component epoxy resin. The new adhesive displays a 150% higher strength after seven days of storage at 85% relative air humidity and a temperature of +85C. It keeps its strong adhesion even after typical ageing tests, such as the MSL1 test, in accordance with JEDEC standard. When using 1mm x 1mm2 silicon dies, the test revealed adhesion values of 47N on FR4 substrate and 62N on gold.
The flow properties of the adhesive are intended to provide dispensing using jet valves and needles. Due to this flexibility, the adhesive provides versatile application options. Tests carried out jointly by the company and its technology partner ASM Assembly Systems show the excellent dispensing properties of the die attach adhesive – employing, among other dispensing systems, the 'Glue Feeder'. This jet valve enables the adhesive to be dispensed contactless and upside down. The adhesive is applied direct to the specific component and not to the PCB, a solution that assures fast and highly precise processes. Depending on the dispensing devices, drop sizes down to below 250µm can be delivered. Even after several shots, the dispensing patterns continue to be uniform and do not show typical unwanted effects such as satellite droplets.
Curing occurs at +130C in ten minutes. The fluorescent adhesive is offered in 10cc cartridges and can be ordered in quantities of just one. Once opened, the product can be used in a user-friendly way for up to seven days in a regular climate of +23C.
