MEMS microphones and plug and play development platform now available

TDK Corporation now offers the InvenSense T5838 and T5837 MEMS microphones and the SmartSound One Development Platform. These MEMS microphones push the boundaries of microphone acoustic performance, power efficiency, and advanced feature sets in small package footprints. SmartSound One provides a solder-free, plug-and-play interface to evaluate and create multiple types and configurations of microphones.

The microphones provide the world’s lowest power PDM multi-mode MEMS microphone with a high acoustic overload point of 133dB SPL, high SNR 68 dBA, and wide dynamic range ideal for environments that shift from extremely quiet to very loud, such as far-field voice pickup for smart speaker to ANC TWS applications.

T5837 is a very low power wide dynamic range PDM digital microphone with industry-standard features of multiple modes of operation such as high quality, low-power (Always On), ultrasonic, and sleep mode. Its high-quality mode provides an SNR of 68dBA while consuming only 310µA of supply current at 1.8V. Low-power (Always On) mode provides an SNR of 65.5dBA while consuming just 120µA of supply current at 1.8V.

The device is aimed at smartphones, TWS earbuds, tablets, cameras, Bluetooth headsets, smart speakers, notebook PCs, and the security and surveillance market.

The T5838 is a very low power wide dynamic range PDM digital microphone with new acoustic activity detect providing industry-leading acoustic performance, modes of operations, and low current draw as seen on the T5837 Acoustic activity detect, a new ultra-low power edge processing feature where the microphone monitors the acoustic environment and, when activity is detected can wake up the main SoC or application processor out of a deep power-down mode. This can maximise the system battery life. It is offered with three modes of operation starting at only 20µA, supplying user programmability for diverse filters and thresholds to optimise performance for every application.

Targeted applications include smartphones, TWS earbuds, tablets, cameras, Bluetooth headsets, smart speakers, notebook PCs, security and surveillance markets, high-end voice-activated remote controls, and voice-activated equipment.

The solutions are offered in small 3.5mm × 2.65mm × 0.98mm bottom port packaging.