Bare die SiC selected for the newest line of power modules

28-03-2023 | ROHM Semiconductor | Power

ROHM has revealed that Apex Microtechnology is adopting its SiC MOSFETs and SiC SBD for a new series of power modules. This product family includes the three-phase SA310 module, excellent for driving high-voltage BLDC motors, and two half-bridge devices, SA110 and SA111, perfect for a broad range of high-voltage applications.

The company's 1,200V S4101 SiC MOSFETs and 650V S6203 SiC SBD are provided in bare die form, allowing Apex to save space and improve the performance and reliability of its modules. As well as the SiC devices, its new line of power modules use ROHM's tightly matched BM60212FV-C gate drivers in Bare Die format, adding to the high-efficiency operation of high-voltage motors and power supplies.

By employing these parts in bare die form, Apex has increased the levels of integration supplied by these power modules. According to a study commissioned by the company, such modules are often 67% smaller than discrete solutions produced by customers. Apex can often include MOSFETs, gate drivers and SBDs and bootstrap supply and bypass capacitors with compact surface mount form factors.

Greg Brennan, president, Apex Microtechnology, commented: "Apex Microtechnology's portfolio of high power, high precision analog and mix-signal solutions are used in some of the world's most demanding applications. Our devices power systems ranging from medical equipment in a surgical suite, to flight instrumentation, to satellites in orbit. This in mind, Apex designs its products to meet or exceed the most stringent standards throughout the industry, and as such, we seek to partner with suppliers sharing our high standards of quality and care. In this respect, ROHM has shined as a supplier of SiC components for Apex. Not only has the service and support we have received from ROHM been excellent, but they have been able to stably supply us throughout the semiconductor shortages, allowing us to continue production and on-time deliveries to our customers. As Apex continues to develop innovative analog and mix-signal solutions in order to solve the industry's complex challenges, we look forward to additional collaboration with ROHM."

Jay Barrus, president, ROHM Semiconductor USA, LLC, stated: "We are excited to help Apex Microtechnology, a part of Electronics Technologies Group of HEICO Corporation. They design precision power analog monolithic, hybrid and open-frame components for a wide range of industrial, test, measurement, and other applications. ROHM is the leading company in SiC power semiconductors and have achieved a significant technological lead in this field along with the provision of power solutions combined with gate driver ICs. Together with Apex Microtechnology, we want to further improve the efficiency of high-power applications by fully exploiting the potential of ROHM's strengths in power and analog technologies."

By Seb Springall