Die attach epoxy meets NASA low outgassing requirements

The Master Bond EP17HTDA-2 is a one-component epoxy that may be employed for bonding, sealing and die attachment. It is not premixed and frozen, and it cures with heat. This dimensionally stable system offers exceptional mechanical properties with high modulus and die shear strength, and it transfers heat and resists thermo-mechanical stresses effectively.

This epoxy provides outstanding temperature resistance with a service temperature range of -80F to +600F [-62C to +316C] and a Tg of 185-190C. This compound offers a thermal conductivity of 9-10 BTU•in/ft2•hr•F [1.30-1.44 W/(m·K)], a low coefficient of thermal expansion, and is electrically insulative with a volume resistivity greater than 1015-Ohm-cm. It resists various chemicals, including acids, bases, fuels, oils, salts, water and many solvents.

As a one-part system, EP17HTDA-2 does not require mixing and is curable in the temperature range of 300-350F for around 4-5 hours. A 2-3 hours post-cure at 400F is recommended to optimise properties. It bonds well to various substrates, such as metals, ceramics, plastics and composites. Upon curing, it provides a tensile modulus exceeding 1,100,000psi and a die shear strength of 20-23kg-f at room temperature (2mm x 2mm [80mil x 80mil]). It also has minimal shrinkage when curing.

While it is ideal for electronic and related applications, it may also be employed in vacuum situations as it passes NASA low outgassing testing. It is a thixotropic paste, yet it is provided in 10cc and 30cc syringes for automated dispensing and has a shelf life of 3-6 months when stored at 40-50F.