MLCCs offer unique composition for special conductivity

KEMET realises the connection of several MLCCs to a single surface-mountable component with its KONNEKT technology. It is a high-density housing technology that can connect components without a metal frame. That helps to lower the ESR, ESL, and thermal resistance of capacitors significantly. The surface-mount U2J, KC-Link, and C0G capacitors are primarily designed for high efficiency and packing density power applications. KEMET's X7R series capacitors are employed when higher capacitances and voltages require additional space on the PCB. The capacitors (U2J, KC-Link, X7R, and C0G) are provided with case sizes 1812, 2220 and 3640. The devices are available now from Rutronik.

The technology uses an innovative TLPS material in which a low melting point metal or alloy reacts at low temperature with a high melting point metal or alloy to form a reactive metal matrix. The result is a highly conductive interconnect material that can be employed to join multiple MLCCs. The result is stacked 'multi-chip' devices without lead frames that can be aligned horizontally and vertically. This makes it straightforward to decrease the space needed on the PCB.

Suitable applications include WBG, SiC, and GaN-based systems. Other applications include data centres, EV/HEV (drive systems, charging), LLC resonant converters, switched tank converters, wireless charging systems, photovoltaics, power converters, inverters, DC links, and snubbers.