Efficient EV charging system solutions

Infineon Technologies AG has expanded its 650V CoolMOS CFD7A portfolio by releasing the QDPAK package. This package family is intended to supply equivalent thermal capabilities with improved electrical performance over the well-known TO247 THD devices, allowing efficient energy utilisation in onboard chargers and DC-DC converters.

Efficient and powerful EV charging systems help reduce charging times and vehicle weight, increasing design flexibility and reducing the total cost of vehicle ownership. This addition complements the existing series, delivering versatility with top-side and bottom-side cooled packages. The QDPAK TSC (top-side cooled) allows designers to achieve higher power densities and optimise PCB space.

The package provides several important features for reliable operation in high-voltage applications. Thanks to its reduced parasitic source inductance, the device can minimise EMI, ensuring clear signals and consistent performance. The Kelvin source pin also supplies improved precision for current sensing, providing accurate measurements even in challenging conditions. With a creepage distance suitable for high-voltage applications, as well as high current capability and high power dissipation (P tot) of up to 694W at 25C, it is a versatile and powerful device for a wide range of high-voltage applications.

New system designs using 650 V CoolMOS CFD7A in QDPAK TSC will maximise PCB space use, doubling power density and improving thermal management through substrate thermal decoupling. This approach simplifies assembly, eradicates board stacking and decreases the need for connectors, lowering system costs. The power switch reduces thermal resistance by up to 35%, providing high power dissipation that outperforms standard cooling solutions.

This feature overcomes the thermal limitations of bottom-side cooled SMD designs using FR4 PCBs, greatly boosting system performance. The optimised power loop design locates drivers near the power switch, improving reliability by reducing stray inductance and chip temperatures. These features contribute to a cost-effective, robust, and efficient system ideal for modern power needs.