High-performance 1200V half-bridge modules in S3 package

SemiQ will showcase its latest SiC power solutions and recently launched KGD screening process at PCIM Europe 2024.

During the event, the company will debut the latest addition to its QSiC family of high-speed-switching MOSFET half-bridge modules in S3 packages, which provides enhanced design flexibility and performance in current applications. Featuring industry-standard 62mm footprints and standing at 26.3mm in height, the new power modules meet the size, weight and power demands of challenging applications, ranging from induction heaters, welding equipment and UPS to photovoltaic and wind inverters, energy storage systems, high-voltage DC-DC converters and battery charging systems for EVs. They are available in 600A (GCMX003A120S3B1-N) and 400A (GCMX005A120S3B1-N). Visitors can also see the company's QSiC family of 1200V modules in SOT-227, half-bridge and full-bridge options.

Attendees will have the unique opportunity to learn more about the recently launched KGD screening program and see the company's MOSFET bare die on KGD UV tape array for the first time. The KGD process delivers high-quality, electrically sorted, optically inspected advanced SiC MOSFET technology ready for back-end processing and direct die attachment.

"We're thrilled to participate at PCIM, a significant event in the power electronics industry," said Dr Timothy Han, president of SemiQ. With the expansion of our QSiC family, our goal is to offer a comprehensive, high-performance SiC portfolio across various sectors and customized solutions for cutting-edge designs. Our continued dedication to rigorous testing and quality assurance, delivering unmatched reliability, is embodied in our new KGD program, which we will be demonstrating at the event."

PCIM Europe 2024, Hall 7, Booth 418, from June 11-13, 2024.