Low-price SoM with wide range of connectivity options suits rugged environments

Direct Insight now provides tiny, low-cost QSMP-13 solder-down QFN-style SoMs featuring the STMicro STM32MP135C.

Commented David Pashley, CEO of Direct Insight: “The QSMP-13 is our lowest-cost module, with a volume price of close to £20. Despite that, it’s got a good range of interfaces and is available as a solder down module which makes it very easy to design in: developers can even create a simple two-layer baseboard.”

Manufactured by the company’s long-standing partner, Ka-Ro Electronics, the QSMP module family’s STM32MP1 processors produce high performance via the QSMP-15’s STM32MP157A with dual 650MHz ARM Cortex-A7 core and GPU, and very low-cost thanks to the STM32MP135C single core version – the QSMP-13. RAM, Flash memory, and power management are also included. All modules provide an extended temperature spec of -25C to +85C, single 3.3-5V supply and production-ready Linux BSP within a Yocto package. The module’s wide range of connectivity options includes CANbus, UART (x5), SPI (x2), I2C (x2), Audio, Gb Ethernet, SD, USB Host and Client and a parallel RGB display.

Packaged as a 27mm x 27mm device measuring 2.3mm high, the solder-down configuration of the QSMP-13 employs a QFN-type pinout style which features a 1mm pitch with 100 edge-located pads, which permit simple two-layer baseboards, if needed. Modules can be soldered directly to a baseboard, eradicating unnecessary connectors while improving thermal efficiency and saving space. Optimised layout minimises EMI problems. The single-sided design means that no components are subjected to third reflow pass and no buried contacts need X-Ray inspection. Therefore, the modules are excellent for rugged environments.