Surface mount package offering expanded with new LFPAK 5x6 package

Alpha and Omega Semiconductor Limited has expanded its new, highly robust power MOSFET LFPAK 5x6 package. Its new LFPAK product offering is provided in a wide range of voltages: 40V, 60V, and 100V. It is designed to withstand harsh environments while maintaining MOSFET performance. The new devices are found in various applications, such as industrial, server power, telecommunications, and solar, where high reliability is required.

The company's LFPAK packaging allows higher board-level reliability due to key packaging features such as gull-wing leads, which provide a rugged solution for board-level environmental stresses. The gull-wing leads also allow optical inspection during PCB manufacturing. Another feature enhancement is the LFPAK's larger copper clip, which improves electrical and thermal performance. Advantages of the large clip include enhanced current handling capabilities, decreased on-resistance, and better heat dispersion compared to wire bonding. A large clip also has low parasitic inductance, enabling lower spike voltage in switching applications. All these features greatly improve the robustness of the MOSFET and use the company's advanced shielded gate. MOSFET Technology (AlphaSGT) permits designers to find an optimised solution to achieve high reliability under the harshest environmental conditions.

"Designers have long trusted AOS power semiconductors in their applications, and LFPAK 5x6 will expand solution capability," said Peter H. Wilson, marketing senior director of the MOSFET product line at AOS.