Small-sized high-speed photorelay for semiconductor testers

25-11-2024 | Toshiba | Semiconductors

Toshiba Electronics Europe GmbH has released a new low-voltage, high-speed photorelay. Particularly suited for the pin electronics of semiconductor testers, the TLP3450S makes measuring DUTs at fast speeds more precise. It is also ideal for probe cards, measuring instruments and various industrial equipment.

The new device is based upon an upgraded internal configuration with enhanced infrared LEDs coupled with photodiode arrays with an optimised design. As a result, the turn-on switching time (tON) of the new device is below 80μs. Compared to the previous generation (TLP3450), this represents a 40% improvement, which will greatly benefit the overall throughput of the ATE system.

The device has a smaller output capacitance (COFF) of only 0.6pF, which decreases high-frequency signal leakage when the output is turned off – this will lower the noise and improve the accuracy of multiplexing structures. The device also has a lower on-resistance (RON) – typically 6.8-Ohm) that improves signal attenuation when the output is in ON state.

The device has an input-output isolation (BVs) rating of 500Vrms and can operate at ambient temperatures between -40C and +110C. It is configured as a form A contact device and can source 160mA (ION) continuously. The pulsed rating is 480mA (IONP).

Complex ATE systems need small components to enhance mounting density. To achieve this, the TLP3450S is housed in a tiny S-VSON4T package measuring just 1.45mm × 2mm × 1.3mm – an 18% reduction in footprint compared to conventional products.

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.