Miniaturised leadless logic ICs save space and improve reliability in automotive applications

Nexperia has introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. Miniaturised logic ICs are essential for space-constrained applications, including sophisticated automotive applications such as chassis safety systems, battery monitoring, infotainment units, and ADAS. MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB footprint than traditional leaded mini logic packages that also feature side-wettable flanks to support AOI of solder joints.

This release reinforces the company's leadership position in the logic industry with innovative packaging that meets the growing requirements of the automotive industry. Leadless packaging with side-wettable flanks improves manufacturing reliability by enabling the usage of AOI techniques to examine the quality of solder joints, thereby accelerating board production. This helps to decrease costs while still meeting the strict criteria of perfectly soldered joints.

The company's SOT8065-1 MicroPak XSON5 has five terminals and measures only 1.1mm × 0.85mm × 0.47mm, making it excellent for use in space-constrained automotive applications. It is free from delamination and provides the highest immunity to moisture MSL-1. Uniform 7μm Sn layer on pad sides and bottom to prevent oxidation and is RoHS and dark green compliant. SOT8065-1 devices use the same die as the SOT353 package but provide a smaller PCB footprint with superior solder durability and enhanced electrical performance.

To manage the automotive industry's growing demand for miniaturised logic ICs, the company offers 64 AEC-Q100-certified devices in MicroPak XSON5 packaging.