Boost efficiency and expand possibilities with advanced H-bridge drivers

Toshiba Electronics Europe GmbH improves motor control solutions by releasing two single-channel H-bridge drivers for brushed DC motors. These new drivers, TB67H453FNG and TB67H453FTG, feature maximum motor output ratings of 50V and 3.5A, ensuring they can handle a broad range of DC motor driving applications and combine robust performance with advanced features, developed to optimise efficiency and widen application possibilities.

Central to these drivers is a built-in current monitoring function that facilitates real-time feedback. This enables external devices such as CPUs and MCUs to track the load current and adjust control signals dynamically, optimising motor performance under variable conditions. Also, the current monitoring can be employed to detect torque changes and react accordingly, for example, when an endpoint is reached. The result is superior energy efficiency with precise motor operation and fewer external components, fulfilling the growing demand for smarter, more adaptable motor control in consumer and industrial equipment.

Among other error detection features, the drivers incorporate overcurrent detection (ISD), which shuts down the output stage if the motor current surpasses a predefined limit. A fault signal indicates this abnormally high current in the motor coils and can also help to detect issues throughout operation, supporting predictive maintenance.

With an operational motor power supply range spanning 4.5V to 44V, the drivers are ideal for an extensive array of applications, from battery-powered devices to equipment using commercial power sources. Their ultra-low current consumption in sleep mode, capped at 1μA, further improves energy savings, making them excellent for battery-operated solutions like cordless cleaners.

In addition to motor control, including a half-bridge independent control mode unlocks new opportunities, allowing the use of these drivers in devices such as smart meters. This versatility makes the TB67H453FNG and TB67H453FTG an exceptional choice for developers seeking a single, adaptable solution for multiple design requirements.

The TB67H453FNG is housed in an HTSSOP package measuring 5mm × 6.4mm, while the TB67H453FTG is housed in a VQFN package measuring 3mm × 3mm. Both packages are supplied with an exposed thermal pad for improved thermal performance and reliability.