New industrial embedded AI box available now

Advantech has released its EPC-R7300 Orin Nano Super, an industrial embedded AI box PC featuring the NVIDIA Jetson Orin Nano 8GB SoM. Employing the powerful NVIDIA Jetson Orin platform, the EPC-R7300 delivers up to 67 TOPS of AI performance with ultra-low power consumption (25W). Its ultra-compact design (152mm × 173mm × 50mm) and Ubuntu OS readiness enable seamless AI deployment, making it excellent for next-generation applications such as small Large Language Models (LLMs), Vision-Language Models (VLMs), and Vision Transformers (ViTs).

The PC, coupled with Jetpack 6.2, presents notable advancements in AI performance, making it an excellent platform for deploying small LLMs, VLMs, and ViTs. With improved GPU, CPU, and memory capabilities, the device efficiently supports models with fewer than ten billion parameters, facilitating tasks such as natural language understanding and generation directly on embedded devices. This capability supports diverse embedded applications such as conversational AI in robotics, voice interfaces for IoT, real-time translation, retail analytics, and industrial data and vision processing. Supporting small-scale LLMs, VLMs, and ViTs provides developers with a powerful, efficient, and privacy-focused solution, allowing real-time embedded intelligence across industries.

This industrial-grade AI Box PC is engineered to satisfy the diverse computing needs of developers with its versatile I/O features, including RS-485, CAN bus, and multiple Ethernet ports. Supported by NVIDIA JetPack, it ensures a seamless migration from NVIDIA's development ecosystem and simplifies integration by automatically allowing I/Os without needing additional driver installations or configurations. The device supports USB and IP camera interfaces for edge AI applications such as image inferencing, which demand high-quality camera inputs, making it excellent for vision-based systems. Also, it offers 4K resolution displays via its HDMI 2.0 port while ensuring reliable data connectivity with 2 x GbE LAN ports. To expand functionality, the device includes 2 x USB 3.2 Gen 1 ports, 3 x M.2 slots for wireless modules and storage expansion (1 x 2230 E-Key: Supports Wi-Fi 6 and Bluetooth, 1 x 3042/52 B-Key: Enables 4G/5G connectivity, 1 x 2280 M-Key: Comes pre-installed with a 128GB NVMe SSD, with further expansion capability). With its robust features and ease of integration, the PC is a powerful and flexible solution for developers building next-generation edge AI systems.

The AI Box PC is engineered for durability in harsh industrial environments, supporting a wide operating temperature range (-20c-60C/-4F-140F), wide power input range (9-36VDC), and high vibration tolerance (3Grms). This rugged design allows users to quickly prototype field-side applications, streamlining the development process and minimising the time and resources needed for system integration, verification, and transformation into a ready-to-use edge AI solution.

Designed to fulfil different application requirements in one kit, the EPC-R7300 provides up to five rear I/O configurations, including serial ports (RS-232, RS-485), isolated DIOs, USB 2.0, and a four-port GbE hub to allow system capacity expansion. The I/O peripheral drivers are all integrated into the board support package (BSP) with NVIDIA Jetpack 6.2, making the EPC-R7300 capable of delivering exceptional functionality without further integration work.