New industrial MOSFETs offer improved power density

Infineon Technologies AG is expanding its discrete CoolSiC MOSFETs 650V portfolio with two new product families housed in Q-DPAK and TOLL packages to support more compact and powerful systems.

These diverse product families, with top and bottom-side cooling, are based on the CoolSiC Generation 2 (G2) technology and deliver greatly improved performance, reliability, and ease of use. The product families target high- and medium-power SMPS, including AI servers, renewable energy, chargers for EVs, e-mobility and humanoid robots, televisions, drives and solid-state circuit breakers.

The TOLL package offers excellent Thermal Cycling on Board (TCoB) capability, allowing compact system designs by reducing the PCB footprint. When used in SMPS, it can also lower system-level manufacturing costs. The TOLL package now fits an extended list of target applications, allowing PCB designers to reduce costs further and better meet market demands.

The introduction of the Q-DPAK package complements the ongoing development of the company's new family of Topside Cooled (TSC) products, which includes CoolMOS 8, CoolSiC, CoolGaN and OptiMOS. The TSC family allows customers to accomplish excellent robustness with maximum power density and system efficiency at low cost. It also allows direct heat dissipation of 95%, enabling the use of both sides of the PCB for better space management and reduction of parasitic effects.