Next-gen module for innovative Bluetooth 6 applications

Rutronik is extending its wireless potfolio to include the next-generation PAN B511-1x Bluetooth 6 module from Panasonic. The LE (Low Energy) module is based on the ultra-low-power wireless SoC nRF54L15 from Nordic and combines its most important functions for increased performance and memory with minimal energy consumption. This makes the component particularly suited to use in battery-powered applications. With its small form factor, hybrid castellated holes, and LGA footprint design, the module facilitates optical output inspections, two-layer designs and fast prototyping via hand soldering. The module will be available soon in 'Economy', 'Standard', and 'Premium' versions.

The module features an integrated 128MHz Arm Cortex-M33 processor, 5MB NVM and 256kB RAM.

With a maximum transmission power of up to 8dBm and a typical reception sensitivity of -98dBm (at 1Mb/s) and -106dBm (at 125kb/s in LE mode Long Range), the module is capable of receiginh even very low signals at a wider range.

The component works reliably in a temperature range of -40C to +85C at a voltage range of 1.7V to 3.6V and has additional GPIO interfaces on the underside.

The module is available in three versions:

The Economy version provides Bluetooth 6 and 802.15.4 modules based on nRF54L15, with an integrated chip antenna for applications such as smart lighting, white goods, and industrial sensors.

The Standard model provides Bluetooth 6 and 802.15.4 module based on nRF54L15, with integrated chip antenna for use in applications such as medical devices, wearables, and energy management.

The Premium model provides Bluetooth 6 and 802.15.4 module based on the nRF54L15 with integrated chip antenna, integrated slow clock and additional 4MB flash memory for use in machine learning and matter applications.

Available peripherals include GPIOs (32), high-speed SPI/UART, 4x SPI/UART/TWI, PDM, I2S, PWM, QDEC, and ADC.