Next milestone on 200mm SiC roadmap rolled out to customers

Infineon Technologies AG has made considerable progress on its 200mm SiC roadmap. The company will release the first products based on the advanced 200mm SiC technology to customers in Q1 2025. The products, manufactured in Villach, Austria, deliver first-class SiC power technology for high-voltage applications, including renewable energies, trains, and EVs. Further, the transition of the company's manufacturing site in Kulim, Malaysia, from 150mm wafers to the larger and more efficient 200mm diameter wafers is fully on track. The newly built Module 3 is poised to commence high-volume production aligned with market demand.

"The implementation of our SiC production is progressing as planned and we are proud of the first product releases to customers," said Dr Rutger Wijburg, chief operations officer of Infineon. "By ramping up SiC production in Villach and Kulim in phases, we are improving cost-efficiency and continuing to ensure product quality. At the same time, we are making sure our manufacturing capacities can meet the demand for SiC-based power semiconductors."

SiC semiconductors have revolutionised high-power applications by switching electricity more efficiently, exhibiting high reliability and robustness under extreme conditions, and making even smaller designs possible. The company's SiC products let customers develop energy-efficient solutions for EVs, fast charging stations and trains, renewable energy systems, and AI data centres. The release to customers of the first SiC products based on the 200mm wafer technology marks a substantial step forward in its SiC roadmap, with a strong focus on providing customers with a comprehensive portfolio of high-performance power semiconductors that promote green energy and contribute to CO2 reduction.

As I'nfineon One Virtual Fab' for highly innovative wide-bandgap (WBG) technologies, the production sites in Villach and Kulim share technologies and processes which enable fast ramping and smooth and highly efficient operations in SiC and GaN manufacturing. The 200mm SiC manufacturing activities now add to the company's strong track record of delivering industry-leading semiconductor technology and power system solutions and strengthen the company's technology leadership across the entire spectrum of power semiconductors, in silicon and SiC and GaN.