Medical-grade dual curable adhesive offers rapid fixturing with LED light

Master Bond LED415DC90Med is a one-component, dual-cure adhesive system developed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition upon exposure to 405nm LED light, followed by a short 30-45 minute heat cure at 90C to 95C, making it ideal for bonding heat-sensitive components. The adhesive system passes ISO 10993-5 requirements for non-cytotoxicity and resists common medical sterilants, including glutaraldehyde, peracetic acid, ethylene oxide, and gamma radiation.

Unlike conventional dual-cure adhesives that limit light penetration to approximately 1mm, adhesive system can partially cure or fixture sections up to 6mm deep when exposed to 405nm LED light at the appropriate intensity and for a sufficient duration. This deeper cure capability allows the fixturing of opaque components by permitting light penetration through the adhesive from the sides. A subsequent cure at 90C to 100C for 30-60 minutes is recommended to optimise strength and overall performance.

LED415DC90Med has a thixotropic index of 5.53 at room temperature. It exhibits a tensile strength of 5,500-6,500psi, a tensile modulus of 450,000-550,000psi, and a lap shear strength exceeding 1,000psi (aluminium to aluminium). This rigid system cures to a Shore D hardness of 85-90 with an elongation of 1-3% at 75F. It is serviceable from -80F to +350F, electrically non-conductive (volume resistivity >1014-Ohm-cm), and bonds well to various substrates, including plastics, glass, and metals. LED415DC90Med is available in syringes, half-pint, pint, and quart containers.

The company's medical-grade systems are specifically formulated to comply with USP Class VI and/or ISO 10993-5 standards. Formulations include epoxy, silicone, UV or LED-curable, epoxy-polyurethane blend, and cyanoacrylate chemistries.