New stationary camera for SIPLACE placement machines

ASMPT offers a new stationary camera for its placement machines, which are equipped with SIPLACE placement heads CPP and TWIN. It provides extremely faster processing speeds and more component flexibility – from highly integrated BGAs to large-format OSCs.

Effective immediately, SIPLACE placement machines with SIPLACE placement heads CPP and TWIN can be equipped with the new camera model 56, which provides a detection area of 66mm × 50mm and a resolution of 16.2µm per pixel.

Thanks to its high resolution, the new camera delivers clear quality improvements because it can detect balls with diameters of 80µm. For complex BGA structures like those on AI chips, the new camera provides images with six times more pixels per ball than the conventional system, making it much easier to detect faults. At the other end of the size scale, the camera’s high resolution enables significantly faster and more accurate stereoscopic measurements of special components, which makes the new camera system especially attractive for the automobile industry.

“Our new stationary camera, which can be easily retrofitted, delivers significant advances in quality, performance and component flexibility for electronics manufacturers,” explains Sven Buchholz, vice president of Portfolio Management at ASMPT SMT Solutions. “It enables them to process even highly detailed BGAs reliably and move many complex OSCs from manual to machine-based placement.”

Together with SIPLACE placement heads, the new stationary camera delivers exceptional results in terms of speed and flexibility. The highly flexible, software-controlled SIPLACE CPP head adapts readily to varying needs by switching seamlessly between its three placement modes: collect-and-place, pick-and-place, and mixed mode. This capability allows lines to stay perfectly balanced even during frequent product changeovers with no time-consuming configuration or head changes. On the other hand, the TWIN head is a high-precision pick-and-place twin head specially developed for the end-of-line placement of large, heavy and complex components. The TWIN VHF version of this head can place components weighing up to 300g with precisely adjustable forces of up to 100N.