Smallest IO-Link Transceiver is big on heat dissipation
23-02-2016 | By Paul Whytock
Embedded World Exhibition, Germany: Dissipating sufficient heat from small packages is a long-standing design challenge but industrial systems engineers may well be interested in an IO- Link dual-channel transceiver that dissipates the lowest heat in what Maxim Integrated Products describes as the smallest package available.
It's recognised that the Industry 4.0 revolution is enabling intelligent factories to increase productivity and broaden manufacturing flexibility. IO-Link sensors enable this by bringing intelligence and control down to the factory floor. It's also true that sensors are getting smaller and need to deliver more functionality, while ensuring robust communications. And power is also a critical element because it is difficult to dissipate heat from small sensors.
The MAX14827 dual-channel, 250mA transceiver meets these requirements says Maxim Integrated products while also featuring high-voltage functions commonly found in industrial sensors, including drivers and regulators. It also has two ultra-low power drivers with active reverse-polarity protection which could help to reduce downtime.
For sensors that use a microcontroller, a SPITM interface is available with diagnostics, and for IO-Link operation, a three-wire UART interface is provided, allowing interfacing to the microcontroller UART.
Finally, a multiplexed UART/SPI option allows using one serial microcontroller interface for shared SPI and UART interfaces. The device includes on-board 3.3V and 5V linear regulators for low-noise analog/logic supply rails.
