This programmable ASSP can bridge those interface gaps
17-05-2016 | By Paul Whytock
What is claimed to be the first programmable bridging device that resolves interface mismatches between mobile application processors, image sensors and displays has been developed by Lattice Semiconductor.
Very often systems with embedded cameras and displays do not have the correct type or number of interfaces and this can be resolved using a bridge. The Lattice CrossLink device combines an FPGA and an ASSP to create a new design called a programmable ASSP (pASSPTM).
The is the first product in this category type and is seen by the company as a solution for virtual reality headsets, drones, smart phones, tablets, cameras, wearable devices and human machine interfaces (HMIs).
CrossLink features include a MIPI D-PHY bridging device that delivers up to 4K UHD resolution at 12 Gbps bandwidth, support for interfaces such as MIPI D-PHY, MIPI CSI-2, MIPI DSI, MIPI DPI, CMOS, and SubLVDS, LVDS, a small package size with a 6mm2 option and an integral sleep mode.
With image sensing apps the CrossLink bridge can multiplex, merge and arbitrate between multiple image sensors to a single input. It can also interface between high-end industrial and popular A/V image sensors with mobile application processors.
With this device it is possible to receive video data from one MIPI DSI interface and then transmit it over two MIPI DSI interfaces at half the bandwidth. The same video stream can be divided to two interfaces which makes it suitable for virtual reality headsets and mobile set top boxes. Customers can also integrate consumer and industrial panels with RGB or LVDS interfaces with mobile applications processors.
The CrossLink bridge can convert from MIPI DSI to multiple lanes of CMOS or LVDS interfaces such as MIPI DPI, OpenLDI and proprietary interface formats for HMIs, smart displays and smart homes.
