Texas Instruments' AI Radar and Audio Chips Enhance Vehicles

Texas Instruments (TI) has introduced a series of innovative automotive chips designed to enhance safety and deliver premium in-cabin experiences across all vehicle types. With the integration of edge AI capabilities and industry-first technologies, these new solutions provide automakers with scalable, cost-effective tools to meet evolving consumer expectations and regulatory requirements.

News Highlights:

• TI’s 60GHz mmWave radar sensor is the industry’s first single-chip solution for three in-cabin safety applications, leveraging edge artificial intelligence (AI).
• Automotive Arm-based microcontrollers (MCUs) and processors with TI’s vector-based C7x digital signal processor (DSP) core deliver premium audio performance.
• TI’s audio amplifier introduces one-inductor (1L) modulation technology, reducing component count while maintaining Class-D audio quality.

“Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences,” said Amichai Ron, senior vice president, TI Embedded Processing. “TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

Advanced Safety with Edge AI-Enabled Radar Sensors

Original equipment manufacturers (OEMs) increasingly integrate sensors to enhance vehicle safety and meet new standards, such as the 2025 Euro NCAP requirements. TI’s AWRL6844 60GHz mmWave radar sensor combines three critical in-cabin safety functions into a single chip, significantly lowering costs and design complexity by replacing multiple technologies like in-seat weight mats and ultrasonic sensors.

Key features of the radar sensor include:

• Seat belt reminders with 98 per cent accuracy in detecting and localising occupants.
• Child presence detection using real-time neural networks to identify micromovements with over 90 per cent accuracy, ensuring safety in parked vehicles.
• Intrusion detection capabilities that intelligently differentiate between external disturbances and actual threats, minimising false alarms.

The sensor integrates four transmitters and four receivers, delivering high-resolution data processed through AI algorithms on a customisable hardware accelerator. This design improves decision-making accuracy while reducing processing time, providing automakers with an efficient and reliable solution.

Premium Audio for Every Vehicle Class

As in-cabin audio expectations continue to grow, TI’s AM275x-Q1 MCUs and AM62D-Q1 processors enable immersive audio features at a lower cost. These processors integrate TI’s C7x DSP core, memory, Arm cores, and hardware security modules into a single chip, reducing the number of components required for automotive audio systems.

Key audio features include:

• Spatial audio for a more immersive sound experience.
• Active noise cancellation to improve cabin acoustics.
• Sound synthesis for custom audio design.
• Advanced networking with Audio Video Bridging (AVB) over Ethernet.

The processors’ neural processing unit supports both traditional and AI-based audio algorithms, offering flexibility for a wide range of vehicle models. With four times the processing power of comparable DSP cores, these processors are capable of handling multiple features simultaneously, from entry-level to high-end audio systems.

Revolutionary Amplifier Technology

The TAS6754-Q1 Class-D audio amplifier introduces one-inductor (1L) modulation technology, cutting the number of inductors required by half. This innovation simplifies system design while delivering industry-leading power efficiency and audio quality.

Engineers also benefit from integrated load diagnostics, which streamline the design process and improve system reliability. By combining this amplifier with TI’s processors, automakers gain access to a comprehensive, scalable audio solution that reduces cost and complexity without sacrificing performance.

TI at CES 2025

At CES 2025, TI will demonstrate how semiconductor technologies make it possible to reimagine experiences everywhere by enabling new levels of automation, intelligence, power efficiency, and affordability. Demonstrations will include innovations in:

• Software-defined vehicles
• Advanced driver-assistance systems
• Robotics
• Medical wearables
• Energy infrastructure
• Personal electronics

Event Details:

• Tuesday, Jan. 7 – Friday, Jan. 10: Visit TI in the Las Vegas Convention Center North Hall, meeting room No. N116.
• Thursday, Jan. 9 at 4 p.m. Pacific Standard Time: Fern Yoon will participate in The Road Ahead: Software Defined Vehicles.

Availability and Pricing

• Preproduction quantities of the AWRL6844, AM2754-Q1, AM62D-Q1, and TAS6754-Q1 are now available for purchase.
• Multiple payment and shipping options are provided.
• Evaluation modules are available for all four devices.

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for industries such as automotive, industrial, personal electronics, and communications. The company’s mission is to make electronics more affordable, reliable, and energy-efficient through innovative semiconductor technology. Learn more at https://www.ti.com/.