Melexis has introduced the MLX90833, a new pressure sensor with Triphibian technology, facilitating robust measurement of gas and liquid media from 2 to 70 bar, all within a compact SO16 package. This factory-calibrated device delivers abso

Melexis | 18-12-2024

The increasing connectivity of road vehicles leads to a growing need for cybersecurity. The United Nations Economic Commission for Europe (UNECE) has therefore adopted the R155 and R156 regulations, which define the cybersecurity requiremen

Infineon | 17-12-2024

Advantech has released the MIC-732-AO and MIC-732D-AO, forming an all-in-one AMR AI system and developer kit embedded with NVIDIA Nova Orin. According to estimates from ABI Research, AMRs will notably impact the logistics market across v

Advantech | 16-12-2024

WIN SOURCE now offers the EP4CE10F17C8N from Intel's Cyclone IV series. The device is equipped with 10,320 logic elements and 504 Kbits of embedded memory, supplying engineers with the resources for complex digital designs. Its efficient op

WIN SOURCE | 16-12-2024

Nexperia has launched 16 new 80V and 100V power MOSFETs in the innovative copper-clip CCPAK1212 package, providing industry-leading power density and outright performance. The innovative copper-clip design supplies high current conduction,

Nexperia | 13-12-2024

Mouser now offers the new CYT3DL TRAVEO T2G 32-bit automotive MCU from Infineon Technologies. The MCUs are dedicated to automotive systems, such as instrument clusters and HUDs. The MCUs provide one of the most scalable safety and graphi

Mouser Electronics | 12-12-2024

Murata will introduce a selection of its next-generation technologies at CES 2025. The booth in the Vehicle Technology Pavilion will serve as a showcase for the products that facilitate innovation throughout the electronics industry. With a

Murata | 12-12-2024

Mouser now stocks the SARA-R52 LTE-M/NB-IoT modules from u-blox. The modules are based on u-blox's UBX-R52 cellular chipset and its M10 GNSS receiver chip. The modules support LTE Cat M1 and LTE Cat NB2 technologies based on comprehensive 3

Mouser Electronics | 11-12-2024

Nexperia has introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. Miniaturised logic ICs are essential for space-constrained applications, including sophisticated automotive applications su

Nexperia | 11-12-2024

Mouser has announced a new eBook in collaboration with TE Connectivity and Microchip Technology. The eBook presents an in-depth look at how zonal architecture is helping designers keep pace with the increasing complexity of automotive syste

Mouser Electronics | 10-12-2024

LG Electronics and Ambarella, Inc. announced that LG will showcase its latest in-cabin solution, developed in partnership with Ambarella, during CES 2025. Ambarella collaborated closely with LG to integrate its CV25 AI SoC into LG's Driver

LG Electronics | 10-12-2024

KIOXIA Europe GmbH, has announced its UFS Ver. 4.0 embedded flash memory devices designed for automotive applications have received Automotive SPICE (ASPICE) Capacity Level 2 (CL2) certification. The company is the first to be awarded this

Kioxia | 09-12-2024

Diodes Incorporated has announced the ZXCT18xQ series of automotive-compliant high-precision current shunt monitors. These single-stage instrumentation amplifiers accurately measure extremely small sense voltages across a broad range of com

Diodes Inc | 09-12-2024

Bourns, Inc. has released the Riedon Model SSD-500A Series Shunt Sensor – Digital by Bourns with 500A nominal current. The extended electrical rating allows designers to utilise a supply voltage of 24V (15mA typical), allowing them to meet

Bourns | 06-12-2024