Industrial


New hybrid flyback controller ICs for ultra-high power density designs

Following the launch of the industry's first PFC and hybrid flyback (HFB) combo IC, Infineon Technologies AG introduces the E-version of its hybrid flyback controller family. Developed for high-performance applications, the new XDP hybrid f

Infineon | 25-03-2025

Tactile switch series lifespan extended for high-use applications

Side-actuated SMT with peg option delivers enhanced mounting strength for telecom, consumer electronics, and home automation devices Littelfuse, Inc. has now announced the C&K Switches PTS845 Series Side-Actuated Tactile Switch with

Littelfuse | 25-03-2025

SMPM bullet adapters eliminate magnetic interference and increase performance

Amphenol RF has introduced new non-magnetic SMPM bullet adapters into its extensive adapter portfolio. With its specially engineered design, this adapter is immune to interference from electromagnetic fields, ensuring constant and reliable

Amphenol | 25-03-2025

Innovating from the data centre to the edge to unlock the full potential of AI platforms

Micron Technology, Inc. has announced it is the world's first and only memory company shipping HBM3E and SOCAMM products for AI servers in the data centre. This extends its industry leadership in designing and delivering LPDDR for data cent

Micron | 25-03-2025

High-temperature relay permits denser board designs

Omron Electronic Components Europe has released the G3VM S-VSON(L) MOSFET relay, which was developed for use in semiconductor test equipment, communication equipment, and test and measurement equipment. The relay can operate at ambient temp

Omron | 25-03-2025

Industry-leading 1200V SiC MOSFETs launched in top-side cooled X.PAK

Nexperia has introduced a range of highly efficient and robust industrial grade 1200V SiC MOSFETs with industry-leading temperature stability in innovative surface-mount (SMD) top-side cooled packaging technology called X.PAK. This package,

Nexperia | 25-03-2025

Entry-level MCUs reduce system costs and complexity in safety-critical applications

To assist engineers in meeting stringent safety requirements while minimising design costs and complexity, Microchip Technology has released the AVR SD family of MCUs. The MCUs feature built-in functional safety mechanisms and are designed

Microchip Technology | 25-03-2025

Exploring innovative memory solutions and design for AI edge applications

Mouser Electronics, Inc. has announced a new eBook in collaboration with Micron, exploring the importance of memory in AI edge applications and the key design considerations for deploying edge AI effectively. Micron is an industry leader in

Mouser Electronics | 24-03-2025

New line of threaded SMPM interconnects released

SV Microwave has released a cutting-edge line of threaded SMPM interconnects, including cable and PCB connectors, adapters, and cable assemblies. These innovative products offer a standard SMPM RF interface, improved with a threaded couplin

SV Microwave | 24-03-2025

Complete li-ion battery management platform with pre-validated firmware

Renesas Electronics Corporation has introduced all-in-one solutions for managing li-ion battery packs in a wide range of battery-powered consumer products, such as e-bikes, vacuum cleaners, robotics and drones. With pre-validated firmware p

Renesas | 24-03-2025

GaN FET portfolio supports wide power needs in low/high-voltage applications

Nexperia has added 12 new devices to its continuously expanding e-mode GaN FET portfolio. This latest release is intended to meet the growing demand for higher efficiency and more compact systems. The new low and high-voltage e-mode GaN FET

Nexperia | 24-03-2025

Vibration-resistant quarter-turn locks for a wide range of applications

With this vibration-resistant quarter turn, EMKA offers a robust lock suitable for a wide range of applications. Whether in rail transport, machine building and plant engineering, or industrial cabinet design, the cost-effective, patented l

Emka | 24-03-2025

Fifth generation of IC family for high-efficiency power supplies launched

Power Integrations has announced TinySwitch-5, extending the output power of the most popular family of integrated off-line switcher ICs to 175W. The new device achieves up to 92% efficiency using basic diode rectification and optocoupler f

Power Integrations | 24-03-2025

High-capacity NVMe SSD for AI applications

KIOXIA Europe has developed its new KIOXIA LC9 Series 122.88TB NVMe SSD in a 2.5" form factor – the first SSD built with the company's BiCS FLASH generation 8 3D flash memory technology 2Tb QLC die. The series, which is under development, w

Kioxia | 21-03-2025

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