As the industry embraces digital transformation and the principles of Industry 4.0, communication protocols in industrial automation are becoming more essential than ever. To facilitate seamless data exchange and control in automation syste

Infineon | 27-03-2025

The XC3S50AN-4TQG144C, available now from WIN SOURCE stands out as a robust and highly adaptable FPGA designed to cater to diverse needs in embedded systems and electronic designs. As part of Xilinx's Spartan-3AN family, this FPGA combines

WIN SOURCE | 27-03-2025

Mouser Electronics, Inc. now offers the new SiWx917Y wireless modules from Silicon Labs. The wireless modules provide ultra-low-power Wi-Fi 6, BLE 5.4, and Matter connectivity for a host of embedded, battery-powered IoT devices in smart hom

Mouser Electronics | 26-03-2025

Following the launch of the industry's first PFC and hybrid flyback (HFB) combo IC, Infineon Technologies AG introduces the E-version of its hybrid flyback controller family. Developed for high-performance applications, the new XDP hybrid f

Infineon | 25-03-2025

Nexperia has introduced a range of highly efficient and robust industrial grade 1200V SiC MOSFETs with industry-leading temperature stability in innovative surface-mount (SMD) top-side cooled packaging technology called X.PAK. This package,

Nexperia | 25-03-2025

To assist engineers in meeting stringent safety requirements while minimising design costs and complexity, Microchip Technology has released the AVR SD family of MCUs. The MCUs feature built-in functional safety mechanisms and are designed

Microchip Technology | 25-03-2025

Nexperia has added 12 new devices to its continuously expanding e-mode GaN FET portfolio. This latest release is intended to meet the growing demand for higher efficiency and more compact systems. The new low and high-voltage e-mode GaN FET

Nexperia | 24-03-2025

Power Integrations has announced TinySwitch-5, extending the output power of the most popular family of integrated off-line switcher ICs to 175W. The new device achieves up to 92% efficiency using basic diode rectification and optocoupler f

Power Integrations | 24-03-2025

Mouser Electronics, Inc. now stocks radiation-hardened LEO A-Grade ICs from Apogee Semiconductor. These ICs include logic devices, level translators, transceivers and more. These devices are fabricated in a 180nm CMOS process using propriet

Mouser Electronics | 21-03-2025

Many industrial applications today are moving towards higher power levels with minimised power losses. One way to accomplish this is to increase the DC link voltage. Infineon Technologies AG satisfies this market trend with the CoolSiC Scho

Infineon | 21-03-2025

onsemi has introduced the first generation of its 1200V SiC MOSFET based SPM 31 IPMs. These IPMs deliver the highest energy efficiency and power density in the smallest form factor compared to utilising Field Stop 7 IGBT technology, resulti

onsemi | 21-03-2025

Silicon Labs has announced its new Series 2 BG29 family of wireless SoCs, developed to bring high compute and connectivity to the smallest form factor BLE devices without compromising performance. The new series is ideal for today's most in

Silicon Labs | 20-03-2025

Texas Instruments has debuted new power-management chips to support modern data centres' rapidly growing power needs. As high-performance computing and AI adoption increases, data centres require more power-dense and efficient solutions. Th

Texas Instruments | 19-03-2025

Würth Elektronik has introduced its new Cordelia-I Wi-Fi module, specifically designed for secure IoT and 'edge computing' applications. This versatile module is excellent for applications in Industry 4.0, Smart City/Smart Home, eMobility,

Wurth | 18-03-2025