FPGAs with lead-free flip-chip bumps achieve highest space qualification

Satisfying mission assurance necessities for the most critical space programs, Microchip Technology’s RT RTG4 FPGAs with lead-free flip-chip bumps have earned the QML Class V status. As designated by the Defense Logistics Agency (DLA), QML Class V is the highest level of qualification for space components, and a required step to satisfy mission assurance needs on the most critical space missions such as human-rated, deep space and national security programs. Because QML qualifications are standardised based on specific performance and quality requirements governed by the DLA, customers can streamline their design and certification processes by using QML-qualified products.

In 2018, RTG4 FPGAs became the first RT FPGAs delivering more than 150,000 logic elements to achieve a QML Class V qualification, and this next-generation solution with lead-free flip-chip bumps is the first of its kind to achieve QML Class V status. In advanced flip-chip package construction, such as that used in the RTG4 FPGA, flip-chip bumps are used to connect the silicon die and the package substrate. Lead-free bump material will help extend the longevity of the product, which is critical to space missions.

“This is another milestone for our RTG4 FPGAs that will provide customers with added confidence in designing these devices in space flight systems while allowing them to take advantage of our high-reliability, zero-configuration-upset and low-power consumption FPGAs,” said Bruce Weyer, corporate vice president for Microchip’s FPGA business unit. “For more than 60 years, Microchip solutions have powered space flight missions, and we are dedicated to product longevity and providing the highest quality solutions.”

These FPGAs are designed to bring high levels of density and performance to space applications, saving cost and engineering efforts via low power consumption and immunity to configuration upsets. Unlike SRAM-based FPGA alternatives, the programming technology used in RTG4 FPGAs provides low static power, which assists in managing thermal issues common in spacecraft.

These FPGAs consume only a fraction of the total power compared to equivalent SRAM FPGAs while displaying zero configuration upsets in radiation, requiring no mitigation and reducing engineering expenses and total system costs.

To achieve QML Class V qualification, the FPGA with lead-free bump has undergone extensive reliability testing, enduring up to 2,000 thermal cycles from −65C to 150C junction temperature. The lead-free flip-chip bump interface connections passed MIL-PRF-38535 inspection criteria and exhibited no signs of tin whiskers. The flip-chip bump is inside the FPGA package, so there is no impact on the user’s design, reflow profile, thermal management or board assembly flow when converting to lead-free bump RTG4 FPGAs.

The company provides one of the industry’s most comprehensive space product portfolios of radiation-hardened and RT solutions, including QML Class Q RT PolarFire® FPGAs and sub-QML FPGAs, bridging the gap between traditional QML components and COTS components. For a comprehensive listing of Microchip FPGA and mixed-signal part numbers alongside their corresponding DLA drawing numbers, please refer to the DLA Cross Reference Guide.

Development kits, mechanical samples and daisy chain packages for board validation and testing support the FPGAs. Libero SoC Design Suite enables RTL entry through programming and includes a rich IP library, complete reference designs and development kits.