Innovation offers precise control over O2 levels in electronics manufacturing

15-02-2024 | Solderstar | Test & Measurement

Solderstar will showcase its latest innovation, the Reflow Shuttle with O2 measurement module, at the IPC Apex Expo 2024. The company will debut this advanced new technology to the US market.

The Reflow Shuttle O2 offers a notable advancement as the first repeatable verification tool that combines real-time oxygen (O2) measurement in parts per million (ppm), vibration levels in three axes, vacuum reading, temperature profiles, and conveyor speed onto a single robust platform. This ground-breaking consolidation of key parameters gives manufacturers comprehensive insights to make informed decisions and optimise their reflow soldering processes to attain higher precision in their advanced soldering applications.

Precise control over O2 levels is paramount in electronics manufacturing due to its potential impact on solder joint quality. Oxygen can lead to oxide formation on metal surfaces during heating; purging the reflow process with nitrogen results in improved wetting and solder joint integrity. The solution allows granular monitoring of oxygen levels within each zone, enabling nitrogen consumption to be quantified and process issues, such as oven sealing issues, to be detected.

CEO of Solderstar, Mark Stansfield, said: "Reflow soldering demands precision and control. The Reflow Shuttle O2 delivers a detailed insight into critical parameters, equipping manufacturers with the tools needed for informed decision-making and process optimisation. By consolidating measurement systems onto a single, robust platform, including O2 ppm, vibration levels, vacuum, temperature profiles, and conveyor speed, we're providing manufacturers with the knowledge to enhance quality and efficiency in their soldering operations with a single pass through the machine.

"We're looking forward to introducing this solution to visitors at IPC Apex, demonstrating our ongoing commitment to advancing industry standards."

In addition to the Reflow Shuttle O2, the company will showcase its zero-set-up SLX thermal profiler during the exhibition. The SLX unit provides comprehensive data capture capabilities, improving process control and product quality.

IPC Apex Expo 2024, Booth 2538, from April 9th to 11th in Anaheim, California.



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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.